另外，有关稳态密度轮廓变陡的解析计算，也正确地反映了有关实验及计算机模拟的结果。
In addition, the analytic calculations for steady state, steepened density profile are also well consistent with the results obtained by using microwave plasma experiments and numerical simulation.
并可进一步作出光谱图像的等密度轮廓曲线和三维立体图形，大大提高了光谱底片数据处理的效率和精度。
In addition, the contour and 3D graph deduced from the image can also be produced. This code can greatly improve the efficiency and precision in film image data processing.
就病变的部位、数目、大小、形状、边缘轮廓、内部结构和密度、骨皮质、骨膜、软组织肿块以及髋关节改变等方面进行了分析。
The following aspects were analysed according to the location, number, size, shape, margin and contour, intralesional structure and density, soft tissue mass, and hip joint change.
结果表明该方法安全可行，能清晰地显示颧腺的位置、轮廓、形态和密度。
Results showed that this method was capable and safe. The position, outline, configuration and density of zygomatic gland and its duct could be clearly displayed on the films.
在电铸过程中，电铸阳极的轮廓和位置决定了阴极表面电流密度的分布，并最终影响电铸层的均匀性。
During the electroforming, the current density distribution on the cathode surface is decided by the anode profile and its position, which will influence the uniformity of the deposit finally.
在有限元方法的基础上，利用变密度法对单搭接胶接接头搭接区域的被粘物形状进行了拓扑优化，通过曲线拟合得到了较为合理的轮廓。
Based on finite element method, variable density method was employed to optimize the configuration of adherends in overlap region, and the curve fitting was applied to attain proper configuration.
借由测量无线电波的折射，我们可以描绘出冥王星大气层(从高空一直到表面)的温度与密度分布轮廓。
By measuring the refraction of this radio beam, we will be able to plot the temperature and density profile of Pluto's atmosphere from high altitude down to the surface.
模制泡沫上层物被设计成具有不同的轮廓和密度，来提供不同舒适外形的预定支撑和感觉特性。
The sculpted foam topper is designed with varying contours and densities to provide the desired support and feel characteristics for different comfort profiles.
要生产出适合于高密度电路板(HDI)使用的低轮廓电子铜箔更加困难和紧迫。
So to produce the suitable low profile electronic copper foil for high density circuit board (HDI) is more difficult and pressing.
要生产出适合于高密度电路板(HDI)使用的低轮廓电子铜箔更加困难和紧迫。
So to produce the suitable low profile electronic copper foil for high density circuit board (HDI) is more difficult and pressing.
应用推荐