由于FT232芯片出场有一个自己的唯一的序号，你就可以在一个多芯片模块的环境下找出正确的设备。
Because the FT232 chips come with a unique serial number, you can identify the correct device within a multichip environment.
此外，它还分别使用双芯片模块(DCM)和多芯片模块(MCM)作为其中端服务器和高端服务器的基本构建块。
Further, it USES Dual Chip Modules (DCMs) and Multi-Chip Modules (MCMs) as the basic building blocks for its mid-range and high-end servers, respectively.
多芯片模块现在采用的有机层压板(MCM - L)、陶瓷(MCM - C)和沉积薄膜(MCM - D)的封装技术。
Currently, MCM is classified as laminated multichip module (MCM-L), ceramic multichip module (MCM-C) and multichip module made by deposited thin film (MCM-D) packaging technologies.
使用GM 8123高速串口扩展芯片扩展核心微处理器串口，实现多模块控制。
Additionally, the serial port of MPU are extended by GM8123 to realize multi-module control.
提出了一种实时图像信息处理系统模块化可扩展的多总线结构，详细论述了其系统总线结构、DSP芯片选型及系统复位流程等系统实现中的关键问题。
Some Key points in system realization, such as the system bus structure, the selection of DSP chips and the process of system reset, were discussed in detail.
以射频识别技术的实际应用为背景，采用TI公司生产的多协议收发器芯片S6700，结合PIC16F877MCU和功率放大模块设计远距离阅读器。
The essay expounds a practical RFID system. The devise adopt the multi-pro IC chip S6700 produced by TI, MCU PIC16F877 and power magnifier module to realize long distance RFID system.
本实用新型公开一种多芯片封装结构，至少包括一承载器、至少一封装模块、一绝缘层及一图案化金属层。
The utility model discloses a multi-chip packaging structure comprising at least a loader, at least a packaging module, an insulation layer and a pattern metal layer.
本实用新型公开一种多芯片封装结构，至少包括一承载器、至少一封装模块、一绝缘层及一图案化金属层。
The utility model discloses a multi-chip packaging structure comprising at least a loader, at least a packaging module, an insulation layer and a pattern metal layer.
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