“当时顾客需要体积较小、运行时温度较低的芯片，”多诺·弗里奥先生说，“我们知道，CMOS有朝一日将证明是更快的技术。”
"Customers were looking for chips that were smaller and ran cooler," says Mr Donofrio. "we knew that at some point CMOS would prove the faster technology."
简要介绍为满足日益增长的低功耗、轻重量、小体积系统的应用需求而涌现出的多种裸芯片封装与多芯片叠层封装技术。
This paper introduces a number of bare and multichip module stacking technologies that are emerging to meet the ever increasing demands for low power consumption, low weight and compact systems.
低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)的一种理想的组装技术。
Low Temperature Co fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multichip modules (MMCM).
低温共烧陶瓷(LTCC)是实现小型化、高可靠微波多芯片组件(MMCM)一种理想的组装技术。
Low Temperature Co-fired Ceramics (LTCC) is an excellent packaging technique for achieving highly reliable and miniature microwave multi-chip modules (MMCM).
多芯片模块现在采用的有机层压板(MCM - L)、陶瓷(MCM - C)和沉积薄膜(MCM - D)的封装技术。
Currently, MCM is classified as laminated multichip module (MCM-L), ceramic multichip module (MCM-C) and multichip module made by deposited thin film (MCM-D) packaging technologies.
本文将主要讨论现阶段一般的封装失效分析的技术与设备，并且重点研究失效分析技术在多芯片封装领域的应用。
In this thesis, the application of the failure analysis in MCP package technology will be addressed along with some general fa instrument and methods.
文章评述多芯片封装技术及目前的基本情况，这一技术在手机存储器的应用现状等。
Multi-chip packaging ( MCP ) technologies and their basi status, state-of-art of applications for mobile phone memory are reviewed in this paper.
在3d -MCM(多芯片组件)封装设计中，大功率和高热流密度导致系统的散热成为关键技术之一。
In 3d-mcm (multi chip module) packaging designs, heat dissipation is one of the key issues that must be solved.
阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。
Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.
同时，列举了当前主要的工艺特征与技术要点，从而说明多芯片封装的技术及其发展前景。
The main and important technological points of MCP are also listed and so that the technological superiority and the developmental prospects of these new package technologies are shown.
本文主要论述了MCM工艺过程及多芯片组装技术中的C4技术。并对M CM种类、MCM关键工艺、M CM凸点的制作方法等做了简单介绍。
This paper described the C4 fabrication of Multi-chip-modules and the MCM process, and also described the key point of MCM technology, the variety of MCM, the bump fabrication methods.
多芯片组件是实现电子装备小型化、轻量化、高性能、低成本专用集成电路不可缺少的关键技术。
MCM is the necessary technique to realize the equipment smaller, lighter, more excellent performance and lower cost.
分别采用三种不同的技术对多芯片组件互连延迟进行建模，并给出了相应的解。
Interconnection delay in MCM 's is modeled by using three different techniques, and the associated formulas are also derived.
COF是一种高性能、多芯片封装工艺技术，在此封装中把芯片包入模塑塑料基板中，通过在元器件上形成的薄膜结构构成互连。
COF is a high performance, multichip packaging technology in which dies are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components.
以射频识别技术的实际应用为背景，采用TI公司生产的多协议收发器芯片S6700，结合PIC16F877MCU和功率放大模块设计远距离阅读器。
The essay expounds a practical RFID system. The devise adopt the multi-pro IC chip S6700 produced by TI, MCU PIC16F877 and power magnifier module to realize long distance RFID system.
文中将涉及微加工技术以及从直流至射频的多芯片全集成新概念。
The concepts of "micromachining" and Multi-Chip-Module (MCM) integrated from DC to RF components will be explained also.
文中将涉及微加工技术以及从直流至射频的多芯片全集成新概念。
The concepts of "micromachining" and Multi-Chip-Module (MCM) integrated from DC to RF components will be explained also.
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