以89c51为例介绍了多片机与上位微机组成所分布式测控系统的硬件接口与通讯技术，并给出了该技术的应用实例。
The technology of interface and communication for 89c51 single-chip microcomputers and personal computer is introduced and its application is given in this paper.
针对U形接触片的技术要求，确定了合理的冲压工艺方案，阐述了该多工位级进模设计要点，产品质量达到设计要求。
A reasonable stamping process scheme has been determined according to the technical requirement of the U-shaped contact plates.
阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。
Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.
阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。
Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.
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