化学蚀刻后逐层测试所得应力沿深度分布与用多波长法测试结果趋势一致,大小略有差异。
The distribution of residual stress along depth gained through layer-by-layer measuring method after chemical etching is in line with that measured by multi-wavelength method.
化学蚀刻后逐层测试所得应力沿深度分布与用多波长法测试结果趋势一致,大小略有差异。
The distribution of residual stress along depth gained through layer-by-layer measuring method after chemical etching is in line with that measured by multi-wavelength method.
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