实验结果表明,对于掺硅组分相同的再结晶石墨,材料的导电、导热性能随着石墨化温度的升高而增强,但其力学性能却随之降低。
Experimental results showed that the thermal conductivity and electrical conductivity improved, but bending strength decreased with increasing graphitization temperature by the same amount of si.
实验结果表明,对于掺硅组分相同的再结晶石墨,材料的导电、导热性能随着石墨化温度的升高而增强,但其力学性能却随之降低。
Experimental results showed that the thermal conductivity and electrical conductivity improved, but bending strength decreased with increasing graphitization temperature by the same amount of si.
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