基于正交试验设计法对塑封球栅阵列(PBGA)器件焊点工艺参数与可靠性关系进行了研究。
The orthogonal experiment design method was applied to study the relationships between solder joint process parameters and reliability of plastic ball grid array (PBGA) component.
基于正交试验设计法对塑封球栅阵列(PBGA)器件焊点工艺参数与可靠性关系进行了研究。
The orthogonal experiment design method was applied to study the relationships between solder joint process parameters and reliability of plastic ball grid array (PBGA) component.
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