本文从空调企业的实际应用出发，通过对码垛技术背景的调研，确认了包装箱自动堆叠技术的必要性。
This article confirms the necessity of packing box stacking technology from the air conditioning business application through the background research.
业务网络层：业务网络采用成熟的以太网交换机冗余技术，比如堆叠或者主备模式。
Service network layer: the service network USES the mature Ethernet switch redundancy technology, such as the stack or main standby mode.
文章介绍了芯片堆叠和封装堆叠的优缺点、关键技术、最新动态和发展前景。
In this paper, the merits and demerits, the key technology, the recent development and the developmental prospects for chip stacking and package stacking are introduced.
阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。
Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.
阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。
Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.
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