• DOVER系列低温固化单组份、低温固化改良型环氧树脂粘剂

    DOVER series low temperature curing adhesives are one part, low temperature heat curable epoxy.

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  • 经济型特别适用于保护表面规整线路板,揭后不会留下任何固化立即揭除。

    Economy tape, especially for protect circuit board with irregular surface. No residue remained when removed. Tear off once it solidify.

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  • 完全固化之前切勿用水冲洗密封

    Can ont be washed by water before fully cured.

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  • 集成电路封装工艺过程中,对导电进行无氧化加热固化质量直接决定了集成电路的质量使用寿命。

    During the integrated circuit packing process, the quality and service life of integrated circuit are decided directly by the quality of conductive adhesive through non-oxidation thermal curing.

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  • 其次用试验找出符合力学模型固化工艺条件并用试验验证用被粘材料的屈服强度估算接头能承受的最大拉伸力的合理性。

    Thirdly, the optimum curing process parameters suitable with the mechanics model are found out and rationality of the estimated value is also validated by test.

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  • 研究一种单组分的弹性环氧密封具有中温快速固化流挂性能,尤其适应工厂的生产流水线

    In this paper, one part elastic epoxy resin sealant was prepared, it has character of rapid middle temperature cure and sag resistance, especially can be applied on line production.

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  • 室温固化铸造双组分聚氨酯浇注制备进行了研究

    The preparation of the two-component casting polyurethane rubber curing at ambient temperature for cast moulds was studied.

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  • 不同环氧固化体系性能存在较大差异改性材料的种类用量结构的性能存在不同程度的影响

    There is great difference in the performance among the different epoxy curing system, the kinds and the contents of the modified components have influence on the performance of the adhesive.

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  • 选用三种不同固化收缩率基体树脂种银粉,分别配制了六种导电

    Based on two kinds of silver powder with different morphology and three matrixes with different curing shrinkage, six electrical conductive adhesives were prepared.

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  • 通过改性环氧树脂固化,实验研究了浸渍粘度韧性及耐冷热冲击性、浸渍

    A sort of modified epoxy resin and curing agent in terms of its viscosity, tenacity, cold-proof and heat-proof impinge and dipping properties were described.

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  • 采用非等温差示热量扫描DSC曲线方法探讨了竹材液化酚醛树脂不同物质的量之固化反应过程

    The curing reaction process of bamboo liquefaction phenolic resin with different molar ratio was studied by non-isothermal differential scanning calorimetry(DSC).

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  • 结果表明,分散剂对谷水中分散起到了极其重要的作用,降低标签黏度冰水能力,延长固化时间。

    The dispersant accelerates gluten's dissolving in water, but it impairs the viscosity, curing velocity and water-resistant ability of the adhesive.

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  • 本文扫描量热法(DSC分别研究了脲醛UF、聚异氰酸酯(PMDI以及它们的混合液加热固化过程

    The curing processes of urea-formaldehyde(UF) resin, polydiphenylmethane diisocyanate (PMDI) and their mixtures were examined respectively by differential scanning calorimetry (DSC).

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  • 介绍SL304中温节能快速固化制版感光主要性能特点

    This paper introduces the main characteristics of SL304 photogelatin for rotary screen stenciling which can quickly cure at lower temperature.

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  • 实验表明,固化转移工艺不仅能够较好地解决溶液丙烯酸酷压的转移施而且有利于降低压敏残留

    The cured-transfer process not only successfully resolved the transfer difficulties in that of solvent-type PSA, but can reduce residues of PSA when debinding.

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  • 讨论制备用作压裂支撑树脂覆膜使用的树脂固化选择、包设备工艺

    The selection of resin and curing agent and the equipment and the technology are discussed for manufacturing resin coated sand as proppant for hydraulic fracturing.

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  • 中间灌注的防火液,经固化透明冻状玻璃成一体。

    Fill with fireproof glue between glass chips, the fireproof glue will show itself clarity colloidal and connect two or more pieces of glasses after solidification.

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  • 介绍了新型聚氨酯湿固化组分密封合成

    The synthesis of one component, moisture-curing PU sealant was studied.

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  • 研究表明,利用微波固化环氧时,不仅固化时间而且剪切强度优于加热固化

    The result showed that, in comparison with cure by heating, the microwave curing was much faster and obtained better shear strength.

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  • 复合催化剂先进缩聚工艺制得的快速固化酚醛树脂具有低毒和快速固化的优点。

    Fast-curing PF resins with low toxicity and fast curing were prepared by using complex catalyticagent and advanced technology.

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  • 本文研究了三种常用酚醛型粘合剂接nbr -金属模压件固化压力依赖性

    In this paper, the curing pressure dependence of NBR-me-tal bonding of three common phenolic adhesives were studied.

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  • 固化材料是通过土壤颗粒作用改变土壤原有的亲水性,使土壤得到固化

    From the glue combination effect among soil grain to change the native hydrotropism to solidify the soil.

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  • 环氧基聚二甲基硅氧烷,以化合物固化交联进行新型成型硫化硅橡的研究。

    By using polydimethylsiloxane containing epoxy groups as base gum, the compounds containing amino groups as crosslinking reagent, a new addition type curable silicone rubber were prepared.

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  • 介绍各向异性导电导电机理接工艺,以及影响粘接可靠性因素最佳参数研究,如粘接温度固化时间、粘接压力粒子含量等

    Many factors impacting on its bonding reliability and the optimum parameters of bonding were studied, such as bonding temperature, curing time, bonding pressure, conductive particles fraction.

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  • 基本固化机翼以便进行下一步安装工作

    After the glue nearly dry, take off the wing for the next installation.

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  • 恰当的稳定体系提高贮存稳定性,较小影响固化速度

    Proper stabilizer can not only improve store stability but also affect a little on cure rate of SGA adhesive.

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  • 石灰为主要成分,通过掺入其它工业废渣类辅助材料,研制了高效膨胀固化

    A new type of high performance expansive soil stabilizer was prepared by adding other industry waste and supplementary cement materials into lime.

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  • 磷酸氧化铜无机套接试件不同粘接表面状态不同固化条件下的扭剪强度进行了系统测试得出了实际应用价值结论

    Under various adherent condition and solidify condition, the Torsional shear strength of the copper phosphate inorganic adhesive were tested. The results which are useful to application were obtained.

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  • 主要阐述聚硫密封构成生产工艺固化机理性能特点应用情况

    This article introduced mainly the composition, the production process, the curing mechanism, the characteristics and the application situation of the polysulfide sealant.

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  • 改性树脂混合树脂为料,导电性填料,并配以适当添加剂、固化制备导电

    Copper conductive adhesive is prepared by using modified resins and mixed resins as cohesive materials and Copper powders as conductive fillers.

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