所述酶产物可能是固体沉积产物。
最新的研究显示从陡坡高速流下的污水不会增加管道腐蚀及留下固体沉积物。
Latest study has shown that high velocities of sewage flow arising from steep gradients do not cause increased erosion of pipes or deposition of solids.
当然沉积的固体水在静止延伸会损害正常的河道水生生物的影响。
Deposition of solids in quiescent stretches of a water course will impair the normal aquatic life of the water course.
建立了用蒙特卡罗和光线跟踪法计算高功率固体激光系统棒状放大器能量沉积分布的模拟程序。
The ray tracing and Monte Carlo method are applied to calculate the distribution of deposited pumping energy within a rod amplifier of the high power solid state laser system.
固体份在电沉积过程中被消耗，用作补充的组份称为补加漆料， 补加漆料包括高浓度的颜料浆和低粘度乳白色的树脂。
Solids are consumed during the deposition process. The components used are referred to as feed. Feed consists of a concentrated pigment paste and low-viscosity, milky-colored resin.
平衡浓度进一步增大，以固体溶液沉积为主。
However, further increase of the concentration results primarily in solid solution precipitation.
电渗是要讨论的最后一个过程，当涂料固体份在阴极上沉积之后，此涂膜为半渗透性。
Electroendosmosis is the final process to be discussed. As paint solids are drawn to the cathode and precipitated, the film becomes semi-permeable.
天然气水合物是在低温高压环境下由水分子和气体分子构成的结晶状特殊固体化和物，它主要分布于永久冻土带及浅海大陆架及深海平原沉积物中。
Natural Gas Hydrate occurs at conditions of low temperature and high pressure, it is a special solid crystal compound composed of natural gas molecule and water molecule.
激光烧蚀溅射沉积薄膜技术是一项新的固体薄膜制造技术。
The fabricating technique of thin solid films deposited by pulsed laser ablating spray is a new technique.
光谱的测量结果支持靶面表层发生爆炸、出射分子簇团和固体微粒的激光烧蚀沉积动力学机制解释。
These experiment results support the dynamic explanation of explosion and ejecting molecular cluster or solid fragments on laser ablation.
超短脉冲激光照射固体靶时可将其能量在极短的时间内沉积在靶表面一个极小的空间范围内，在固体靶表面产生固体密度的等离子体。
Differing from the long pulse laser the ultra short laser will deposit its energy on the surface of the solid target in very short time and produce solid dense plasmas.
采用固体三氧化二硼，用热丝辅助化学气相沉积法在石墨衬底上沉积了掺硼金刚石涂层。
B-doped diamond films were grown on graphite substrates by hot filament assisted CVD method (HFCVD).
通过这个电镀共沉积的过程，我们有可能用一种单一的方法将金锡合金固体焊料直接镀在晶片上的低共熔点上或其附近。
Using a co-electroplating process, it was possible to plate the Au–Sn solder directly onto a wafer at or near the eutectic composition from a single solution.
荧光假单胞菌和碳酸钙在固体表面上附着过程与沉积的顺序以及混合垢的结构则采用显微摄像技术进行实时观测与记录。
On the other hand, the sequence of adhesion and deposit of the bacteria and CaCO3 on glass surface was measured and recorded with micro video technology.
为避免结晶沉积堵塞，对固体亚硫酸铵生产装置提出集中布置设备的原则。
The principle of compact arrangement of the equipment is proposed to avoid build-up of crystal.
作为目前广泛使用的耗时长的固体贴装预制件的代替品，一种用电镀共沉积得到的金锡合金共晶焊料被用于该项研究中。
As an alternative to the time-consuming solder pre-forms and pastes currently used, a co-electroplating method of eutectic au-sn alloy was used in this study.
采用固体三氧化二硼，用热丝辅助化学气相沉积法在石墨衬底上沉积了掺硼金刚石涂层。
B-doped diamond films were grown on graphite substrates by hot filament assisted CVD method (HFCVD). The dopant was solid B_2O_3.
采用固体三氧化二硼，用热丝辅助化学气相沉积法在石墨衬底上沉积了掺硼金刚石涂层。
B-doped diamond films were grown on graphite substrates by hot filament assisted CVD method (HFCVD). The dopant was solid B_2O_3.
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