本发明进一步提供了一种采用上述方法获得的四方扁平无引脚封装结构。
The invention further provides the quad flat no-lead encapsulation structure obtained by the method of the invention.
本发明进一步提供了一种采用上述方法获得的四方扁平无引脚封装结构。
The invention further provides the quad flat no-lead encapsulation structure obtained by the method of the invention.
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