最后以塑料四方扁平封装器件焊点为研究对象，对提出的焊点故障预测技术的有效性进行了试验验证和分析。

And then, the fault prognosis technology of the solder joints is researched based on the HMM model, real-time damage inf…

youdao

最后以塑料四方扁平封装器件焊点为研究对象，对提出的焊点故障预测技术的有效性进行了试验验证和分析。

And then, the fault prognosis technology of the solder joints is researched based on the HMM model, real-time damage inf…

youdao