提供了一种发光器件封装。
分立器件封装也是微电子生产技术的基础和先导。
Discrete device packaging is one of the basis and the pioneer of microelectronic technology.
表面贴装器件封装在磁带和卷轴，便于自动布局。
Surface mount devices are packaged on tape and reel for easy auto placement.
提供一种发光器件封装和制造该发光器件封装的方法。
A light emitting device package and a method of manufacturing the light emitting device package are provided.
电阻缝焊在器件封装等应用中要求电源具有较高的精密性。
A new type of inverter of resistance seam welding power supply was developed for precision welding in device packaging.
各种元器件封装的尺寸，我们经常用到的一些封装，很实用。
Various components Packaging size, we often use the number of packages and practical.
两方法可为筛选光电子器件封装提供依据，并为优化封装的设计提供参考。
The two methods are useful for screening and optimizing the packaging of high-speed optoelectronics devices.
在生产中，为提高其成品率和可靠性，从晶体生长到器件封装每一步工序均有很多细致工作要做。
At every step of production, from crystal growth to device packaging, numerous refinements are being made to improve the yield and reliability.
可用于海洋敏感器件封装的氮化铝陶瓷材料具有高的热导率特性，本文对它的热导率进行了实验研究。
AIN ceramic material with high thermal conductivity, it can be used as the enclosure material for sea temperature sensor.
场发射阴极材料、场发射阳极荧光材料、隔离柱材料以及器件封装工艺是场发射显示器（FED）的三大核心技术难题。
Carbon nanotubes(CNTs) have been thought as one of the most promising cold cathode materials of electron field emitters in field emission display(FED).
致力成为一家综合的半导体测试解决方案供应商，是Electroglas重要的战略目标之一，因此伊智也为器件封装提供后道测试机械手和测试台管理软件。
They now also offer a final test handler for packaged devices and test floor management software as part of their strategy to be a comprehensive semiconductor test solutions provider.
目前，它们被封装进检测光信号的光学器件，以记录磁场的强度。
Recently, they were packaged with fiber optics for detecting the light signals that register magnetic field strength.
小型封装和纤薄的外形使该器件非常适合于印刷电路板区域和元件净空具有非常重要作用的应用。
The small package outline and low profile make this device ideally suited for use in applications where printed circuit board area and component headroom are at a premium.
这些关键应用所考虑的其它因素包括：元件封装设计、工作电源范围和钽器件优异的电容-电压（CV）特性。
Otherconsiderations for these critical applications include component package design, working voltage ranges and the advantageous CV levelsof tantalum devices.
半导体器件，半导体晶片，芯片尺寸封装及制作和检测方法。
Semiconductor device, semiconductor wafer, chip size package, and methods of manufacturing and inspection therefor.
这款新型器件采用安装在具有集成半柱型透镜的3引脚环氧树脂封装模块中的光电二极管及宽带放大器。
The new device features a photo diode and a wide-band amplifier mounted within a 3-pin epoxy- encapsulated module with an integrated semi-cylindrical lens.
树脂封装能缩小器件尺寸、减轻重量、降低成本、促进小型化。
Resin package is be used to decrease size of device, diminish weight, reduce costs and push for miniature.
尺寸小型化与功率高密度化是当今电子封装器件两大主要发展趋势。
The two trends in the electronics packaging component field nowadays are the miniaturization in the size and high intensity in power.
文章介绍了MOEMS器件，主要就其制作工艺和封装技术做了讨论。
This paper proposes MOEMS devices, make process and packaging technology.
本发明提供一种半导体器件的引线框及封装。
The invention provides a lead frame and packaging of a semiconductor device.
IGBT模块封装多层结构的热不匹配将产生热应力从而影响器件可靠性。
Thermal mismatch in IGBT packaging, because of its multiplayer structure, will result in thermal stress, which affects the long term reliability of devices.
利用统计分析手段，对高功率二极管激光器封装中各工艺环节引起器件失效的原因进行了分析和归类。
Using statistics analysis method, diode laser failure states were classified and the causes of these diode laser failures were analyzed in every packaging process.
阐述了MEMS器件及其封装中主要的两种模型。
At last, two kinds of models are Elaborated on MEMS device and its packaging.
封装寄生效应对高频器件性能的影响越来越明显。
Parasitic effects of packaging have significant effect on performance of rf ICs.
由于在印制电路板上的倒装芯片和CSP器件的紧凑设计，声音微图像己经成为检测这些封装的非常重要的一部分。
Because of the compact design of flip chips and CSP on PCB, acoustic micro imaging has become extremely important for inspecting these packages.
该方法从TRL校准出发，实际测量得到封装器件的S参数；
Reliedon the TRL calibration, the device S-parameters was got by practical measurement.
最后用正交试验的方法对肖特基器件后部封装中的压焊工艺进行了参数优化设计。
Finally, wire bonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.
该器件采用封装设计，便于客户使用。
The device package allows for easy implementation by the customer.
利用有限元法研究了堆叠芯片封装(SCSP)器件在封装工艺过程中的热应力分布。
The thermal stress distribution of SCSP in packaging process was studied by finite element method.
利用有限元法研究了堆叠芯片封装(SCSP)器件在封装工艺过程中的热应力分布。
The thermal stress distribution of SCSP in packaging process was studied by finite element method.
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