铝合金锻件中有时有未锻合的疏松和残留的枝晶自由表面，并保留有原始的结晶台阶。
Unhealed porosities and free surface of dendrites with crystalline steps were occasionally observed in aluminium alloy forgings.
介绍了晶圆键合工艺、技术要求、应用选择以及对MEMS的作用；展示了MEMS制造技术和应用前景。
Introduces wafer bonding process, technical requirements, application choice and Interaction for MEMS, and showing MEMS fabrication technology and application prospects.
这种疏松层便是大多数雪崩形成的根源，该层中大的杯状雪晶之间的键合很弱，非常容易断裂。
It's this weak layer that's at the root of most avalanches. The bonds between the large cup-shaped snow crystals in this layer are only weak and they break easily.
分析了金硅共晶键合的基本原理，讨论了键合实验的基本工艺，给出了键合的测试结果。
The principle of eutectic bonding was analyzed. The fabrication process of eutectic bonding was discussed, the test result of eutectic bonding was given.
作为半导体制造领域的一项新兴的使能技术，晶圆直接键合已经在越来越多的领域发挥了重要的作用。
As one of the newly-emerged enabling technologies, wafer direct bonding has been playing key roles in more and more fields.
作为半导体制造领域的一项新兴的使能技术，晶圆直接键合已经在越来越多的领域发挥了重要的作用。
As one of the newly-emerged enabling technologies, wafer direct bonding has been playing key roles in more and more fields.
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