提出了一种基于北京大学硅玻璃键合深刻蚀释放工艺的扩展工艺，用来加工微型隧道加速度计。
A tunneling accelerometer is fabricated and characterized based on the extension of the silicon-glass anodic-bonding and deep etching releasing process provided by Peking University.
采用体微机械加工技术和硅硅键合技术可以实现高性能的加速度传感器。
Using bulk micromachining and silicon bonding we can achieve high-performance full-silicon sandwich accelerometer.
采用体微机械加工技术和硅硅键合技术可以实现高性能的加速度传感器。
Using bulk micromachining and silicon bonding we can achieve high-performance full-silicon sandwich accelerometer.
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