通过制备共烧叠层片式元件实验，指出其难点在于内电极的抗氧化性能以及与陶瓷界面接触上。
After the trial of co-fired multilayer chip type component, found the difficulties were oxidation resistance of interior electrode and interface contact between the electrode and ceramic.
综述近几年来文献报导的关于叠层片式陶瓷电子元件的研究现状。
The recent achievements on the research of the multilayer chip ceramic devices are reviewed in this paper.
综述近几年来文献报导的关于叠层片式陶瓷电子元件的研究现状。
The recent achievements on the research of the multilayer chip ceramic devices are reviewed in this paper.
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