从零件放置、布线和补铜箔等三个方面讨论了在双面印制板设计中如何控制电磁干扰。
The paper discusses how to control the EMI in designing twolayer PCB at three points:part placement, routing and copper pour.
从零件放置、布线和补铜箔等三个方面讨论了在双面印制板设计中如何控制电磁干扰。
The paper discusses how to control the EMI in designing twolayer PCB at three points:part placement, routing and copper pour.
应用推荐