测系统选用进口双列封装的线性和集成电路。
Feb import dual-use monitoring system is linear and IC packaging.
该器件提供两种封装：24引脚、0.3英寸宽、塑料密封双列直插式封装(DIP)和24引脚小形集成封装(SOIC)。
The part is available in a 24-pin, 0.3 inch wide, plastic and hermetic dual-in-line package (DIP) as well as a 24-lead small outline (SOIC) package.
组件采用双列直插式陶瓷管壳封装，很容易制成16、32……160元组件。
This module used DIP ceramic package, therefore it is very easy to form 16, 32,... and 160 unit modules.
双列塑封的信号处理集成电路BY 139平均失效率达到10.8%，方形陶瓷封装的逻辑控制电路PC 11平均失效率达到2.5%。
The average failure rate of signal processing molectron BY139 was 10.8%. And the average failure rate of logical controlling molectron PC11 was 2.5%.
该器件提供两种封装：8引脚、0.3英寸宽、小型塑料或密封双列直插式封装（小型DIP）；以及8引脚小形集成封装（SOIC）。
The part is available in a small, 8-pin, 0.3" wide, plastic or hermetic dual-in-line package (mini-DIP) and in an 8-pin, small outline IC (SOIC)."
AD 7812也提供三种封装：20引脚、0.3英寸宽、小型塑料双列直插式封装(小型DIP)； 20引脚、小形集成封装(SOIC)；以及20引脚超薄紧缩小型封装(TSSOP)。
The AD7812 is available in a small, 20-lead 0.3 "wide, plastic dual-in-line package (mini-DIP), in a 20-lead, small outline IC (SOIC) and in a 20-lead, Thin Shrink small outline package (TSSOP)."
AD 7812也提供三种封装：20引脚、0.3英寸宽、小型塑料双列直插式封装(小型DIP)； 20引脚、小形集成封装(SOIC)；以及20引脚超薄紧缩小型封装(TSSOP)。
The AD7812 is available in a small, 20-lead 0.3 "wide, plastic dual-in-line package (mini-DIP), in a 20-lead, small outline IC (SOIC) and in a 20-lead, Thin Shrink small outline package (TSSOP)."
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