印刷电路板组装清洗后，常常留有许多白色残渣，这些残渣由许多的化学物反应而成。
White residue remaining after cleaning circuit board assemblies can be caused by a variety of chemicals and reactions.
本文比较了印刷电路板在清洗表面之前和之后的焊接能力测量结果。
The paper presents the comparison of printed circuit board solder ability test results measured before and after cleaning.
本文比较了印刷电路板在清洗表面之前和之后的焊接能力测量结果。
The paper presents the comparison of printed circuit board solder ability test results measured before and after cleaning.
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