本文主要介绍了印制电路板组装件焊接后非ods清洗剂清洗质量表征参数的测量方法。
The measurement method of the characteristic parameters of the cleaning quality about welded printed circuit board assembly cleaned by non-ODS cleaner is introduced in this paper.
在组装的印制电路板自动光学检测中，由于印制电路板的热变形，造成检测中焊点位置的偏移导致测试失败。
Because of the thermal distortion, the solder check position has be shifted during Automated Optical Inspection (AOI) for the PCB (Printed Circuit Board) assembled.
在组装的印制电路板自动光学检测中，由于印制电路板的热变形，造成检测中焊点位置的偏移导致测试失败。
Because of the thermal distortion, the solder check position has be shifted during Automated Optical Inspection (AOI) for the PCB (Printed Circuit Board) assembled.
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