过高的湿度会降低印制电路板和测试连接绝缘子的绝缘电阻。
Excess humidity can reduce insulation resistance on PC boards and in test connection insulators.
在组装的印制电路板自动光学检测中，由于印制电路板的热变形，造成检测中焊点位置的偏移导致测试失败。
Because of the thermal distortion, the solder check position has be shifted during Automated Optical Inspection (AOI) for the PCB (Printed Circuit Board) assembled.
在将自动测试设备(ate)应用于印制电路板(PCB)的测试中，开关矩阵的性能将直接影响到ate的通用性。
In the course of printed circuit board (PCB) test by automatic test equipment (ATE), the performance of the switch matrix will affect directly the general purpose of ATE.
在将自动测试设备(ate)应用于印制电路板(PCB)的测试中，开关矩阵的性能将直接影响到ate的通用性。
In the course of printed circuit board (PCB) test by automatic test equipment (ATE), the performance of the switch matrix will affect directly the general purpose of ATE.
应用推荐