本文研究了金刚石车削单晶锗、硅时表面粗糙度随切削方向的变化规律。
The variable regularity of surface roughness on diamond turned single crystal germanium and silicon was investigated in this paper.
本文介绍一种全凭手工切割大口径锗单晶的切片方法。
The method to slice large diameter Ge crystal by hand is shown.
采用直拉法研制了大直径红外光学锗单晶，测量了其光学性能和力学性能。
Major diameter infrared optical Ge Monocrystal was developed by direct pulling method. The optical and mechanical properties were measured.
常用的本质半导体是硅、锗以及砷化镓等的单晶。
Some common intrinsic semiconductors are single crystals of silicon, germanium, and gallium arsenide.
集成电路和各种半导体器件制造中所用的材料，目前主要是硅、锗和砷化镓等单晶体，其中又以硅为最多。
Silicon, germanium and gallium arsenide are popular materials used in ICs and semi-conduct devices, while silicon is the most popular one.
集成电路和各种半导体器件制造中所用的材料，目前主要是硅、锗和砷化镓等单晶体，其中又以硅为最多。
Silicon, germanium and gallium arsenide are popular materials used in ICs and semi-conduct devices, while silicon is the most popular one.
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