研究了间隙长度和间隙位置对不同单搭接接头强度的影响。
The influence of length and position of recessing on the strength of adhesively bonded joints with different single-lap length was presented.
利用有限元方法研究了金属镶嵌对单搭接接头应力分布的影响。
The finite element method (FEM) is applied to investigate the effect of metal inlay in single lap joint on the stress distribution.
研究单搭接接头胶缝中预留间隙对接头拉剪强度和应力分布的影响。
The effect of the recessing on the strength and stress distribution of adhesively bonded single-lap joints is discussed.
运用弹塑性有限元法，研究了胶粘剂弹性模量对含间隙的铝合金单搭接接头上应力分布的影响。
The effect of elastic modulus of adhesive on the str ess distribution in aluminium alloy single lap joint was investigated using elastic-plastic finite element method(FEM).
运用弹塑性有限元法结合实验研究了连续和间隙连接的单搭接接头应力分布规律，并考虑了胶瘤的影响。
The stress distribution of continuous and recessed bonding single-lap joints is discussed with use of elastoplastic finite element method (FEM) and experiment, considering the effect of fillet.
研究了在胶瘤中嵌入三角形金属楔块对单搭接接头强度和应力分布的影响，结果表明，金属楔块能显著提高接头的强度。
The influence of embedded trilateral cross-section metal bar in the fillet on the strength and stress distribution of single lap joints was discussed.
在有限元方法的基础上，利用变密度法对单搭接胶接接头搭接区域的被粘物形状进行了拓扑优化，通过曲线拟合得到了较为合理的轮廓。
Based on finite element method, variable density method was employed to optimize the configuration of adherends in overlap region, and the curve fitting was applied to attain proper configuration.
半导体激光器发出的激光经过柱透镜形成一出射光片。它与母材成一定角度投射到接头上，光片与搭接接头会成一单光纹，而母材垂直上方的CCD摄像机拍摄折线光纹，同步送计算机处理。
The light-plate that is shot by semiconductor laser comes to a certain Angle to throw overlap joint, which brings a single vein of light, and CCD camcorder shoots and sends it to the computer.
半导体激光器发出的激光经过柱透镜形成一出射光片。它与母材成一定角度投射到接头上，光片与搭接接头会成一单光纹，而母材垂直上方的CCD摄像机拍摄折线光纹，同步送计算机处理。
The light-plate that is shot by semiconductor laser comes to a certain Angle to throw overlap joint, which brings a single vein of light, and CCD camcorder shoots and sends it to the computer.
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