结果表明开关的半导体片对照射激光的吸收因子增大了开关的延迟时间，在计算中应该加以考虑。
The results show that the absorption fraction of the semiconductor slab of the switch increases the delay time of switches and should be considered in the calculation.
量子点由磷化铟半导体构成，将它们喷涂在一张透明塑料片上，然后用另一张塑料片进行覆盖，最后将它们进行整体加热封装。
The dots, composed of a semiconductor called indium phosphide, are sprayed onto a transparent plastic sheet that is then covered with a second sheet. That done, the whole thing is heat-sealed.
Melosh的研究小组发现用薄层的金属铯覆盖在一片半导体材料上，能够使材料同时利用光和热能来产生电力。
Melosh's group figured out that by coating a piece of semiconducting material with a thin layer of the metal cesium, it made the material able to use both light and heat to generate electricity.
已经设计出专门的探头来测量半导体晶圆片和半导体棒的电阻率。
Special probes have been designed for making resistivity measurements on semiconductor wafers and bars.
为记录微弱的应变信号，在透射杆中使用了半导体应变片。
Semiconductor gages were used for capturing the weak strain signals in the transmission bar.
电热风幕机根据加热材料不同可分为半导体热敏陶瓷加热器和翅片电热管加热器两种。
The electric hot air curtain machine can be divided into two types of semiconductor thermal sensitive ceramic heater and a fin electric heating tube heater according to different heating materials.
半导体技术的飞速发展推动了片上系统设计进入到片上网络阶段。
The fast development of the semiconductor technology had push the design of SOC into network on chips (NOC).
本文描述了使用共面微波探针的半导体芯片在片测试技术。
We present an on-wafer measurement technique of semiconductor wafer using special coplanar microwave probes.
硅晶圆大圆片上切割而成的一个小片半导体材料。
Die: a single piece of semiconductor material that has been cut from a slice by scribing and breaking.
半导体晶圆背面加工方法，衬底背面加工方法，和辐射固化型压敏粘着片。
Method of semiconductor wafer back processing, method of substrate back processing, and radiation-curable pressure-sensitive adhesive sheet.
半导体激光器发出的激光经过柱透镜形成一出射光片。它与母材成一定角度投射到接头上，光片与搭接接头会成一单光纹，而母材垂直上方的CCD摄像机拍摄折线光纹，同步送计算机处理。
The light-plate that is shot by semiconductor laser comes to a certain Angle to throw overlap joint, which brings a single vein of light, and CCD camcorder shoots and sends it to the computer.
集成电路，一小片内含相互连接的微缩电路的半导体材料。
INTEGRATED circuit, a small piece of semiconductive material that contains interconnected miniaturized electronic circuits.
半导体制冷片多个并联使用时，需要低压大电流的电源提供直流工作电压，为此我们设计了1。
When semiconductor chilling plate is used in parallel connection mode, a DC power supply with a low voltage and high current has to be available.
所述车载音响系统的散热方法是根据车载音响系统的使用状态对半导体制冷片的电流进行控制。
The heat dissipating method of the on-vehicle sound system is that the current of the semiconductor chilling plates is controlled according to the use state of the on-vehicle sound system.
制冷气体由半导体制冷片产生，电流由蓄电池提供，鼓风设备由电动机充当。
Refrigerant gases generated by the semiconductor chip cooling, the current provided by the battery, the electric motor acts as blast equipment.
介绍了半导体飞片系统的原理及特点。
The principle and characteristics of Semiconductor flyer system was introduced in this paper.
利用赛普拉斯半导体公司新型的片上可编程芯片CYWUSB6953来完成基于无线usb技术的数据传输平台的构建。
It has utilized the construction of data transmission platform based on Wireless USB by using chip CYWUSB6953, which is the newly PSoC chip made by Cypress Semiconductor Corp.
集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。
IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
透明胶材包覆所述多个化合物半导体裸片。
The compound semiconductor bare chips are coated by the transparent adhesive.
本发明公开了一种半导体器件与集成电路硅单晶废弃片的回收利用方法。
The invention discloses the method of reclaiming and utilizing the silicon single crystal waste of semiconductor device and integrated circuit.
另一些对于晶圆片级半导体的弱电流测量则通常与介电材料(氧化物或化合物)的质量有关。
Other typical low current measurements on wafer level semiconductors are related to the dielectric, either the oxide or compound quality.
因此，在半导体行业中，必须快速、准确地对硅晶圆片导电类型、方块电阻和电阻率进行判断、测量和分档。
Therefore, in the semiconductor industry, we must quickly and accurately type conductive film on silicon wafers, the square resistance and resistivity of judgement, measurement, and grading.
我公司产品广泛用于石材、陶瓷、刹车片、金属、半导体及其他材料的切磨加工等领域。
Our company widely applies in stone material, ceramics, brake lining, metal, semiconductor and other material domains and so on cut and polished processing.
我公司产品广泛用于石材、陶瓷、刹车片、金属、半导体及其他材料的切磨加工等领域。
Our company widely applies in stone material, ceramics, brake lining, metal, semiconductor and other material domains and so on cut and polished processing.
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