该模拟结果对大功率半导体激光器阵列的封装设计具有现实的指导意义。
The simulation results can guide the packaging of the high power semiconductor laser array.
大功率半导体激光器阵列(LDA)的应用日益广泛，但受其发光机制的限制，光束质量较差。
The application of high-power laser diode arrays (LDA) is becoming wider and wider, but the quality of output beams from LDA is poor for its unique mechanism of luminescence.
利用ANSYS软件模拟半导体激光器阵列芯片及载体中的稳态及瞬态热分布是本论文的重点。
The important part of this article is to simulate the stable and transient thermal distribution using the Analysis system (ANSYS) software.
本实用新型涉及一种激光切割机的光源的谐振腔，特别是采用半导体激光器阵列产生高亮度的激光光源的谐振腔。
The utility model relates to a resonant cavity of a laser cutter, especially a resonant cavity for producing high-brightness laser by adopting semiconductor laser array.
本文主要利用第一类方法，对半导体激光器阵列的稳态热阻进行测量，并详细介绍了半导体激光器各个参数的测量方法。
In this article, we used the first method to test the stable thermal resistance, and we introduced some testing methods to test the parameters of semiconductor lasers.
它利用半导体激光器为光源，光电二极管阵列接收与表面粗糙度具有对应关系的散射光带。
It USES a laser diode as light source and a linear photodiode array to record the light-scattering band, which correlated to the surface roughness.
介绍了大功率半导体激光器二维阵列的光纤耦合技术，其中有整形耦合法、偏振合束法和波长合束法。
Fiber coupling technique for high-power diode laser 2D arrays was introduced, such as beam-shaping, polarization multiplexing and wavelength multiplexing.
介绍了大功率半导体激光器二维阵列的光纤耦合技术，其中有整形耦合法、偏振合束法和波长合束法。
Fiber coupling technique for high-power diode laser 2D arrays was introduced, such as beam-shaping, polarization multiplexing and wavelength multiplexing.
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