本发明提供一种氢活化材料，其包括一种作为主要成分的包含铁和半导体成分的铁-半导体合金。
The invention provides a hydrogen activating material, which includes as a major constituent an iron-semiconductor alloy containing iron and semiconductor components.
我们主要注意磁光型存储的非晶态稀土-过渡金属合金薄膜和相变型光存储的非晶态半导体薄膜两个方面。
The main attention has been paid on amorphous rare earth- transition metal alloy films for magneto-optical storage and amorphous semiconductor films for phase change optical storage.
金刚石砂轮广泛用作硬质合金、工程陶瓷、光学玻璃、半导体材料、花岗岩等硬脆难加工材料的磨削工具。
Diamond grinding wheels are widely used as grinding tools in manufacturing of hard and brittle materials, such as hard alloy, engineering ceramics, optical glass, semiconductor materials, and granite.
该研磨纸可 用于众多工件的研磨和抛光，包括金属、金属合金、陶瓷、光学元件、光纤连接器、硬盘、半导体等领域。
The emery paper is applicable in the grinding and polishing of most work pieces including metal, metal alloy, ceramic, optical element, fiber connecter, hard disc and semiconductor, etc.
高纯度金属镓是生产化合物半导体材料的基础材料，同时它还可以用于生产超导材料、合金材料、永磁材料等。
High purity gallium metal is the basic ingredient for semiconductor compound material, and it is also highly utilized in the manufacture of super conductor material, alloy, alnico etc.
对于半导体材料，有利地可以使用铟合金，而对于掺杂材料，可以使用硒或碲。
As a semiconductor material advantageously an indium alloy and as a doping material selenium or tellurium can be used.
半导体制程技术包括氧化、扩散、热处理、合金化、再流动制程、铜制程及化学机械研磨制程简介。
Introduction to semiconductor manufacturing technology including oxidation, diffusion, alloying, re-flow process, copper process and chemical-mechanical polishing.
并主要针对在半导体器件中应用最为广泛的金-硅合金焊接失效模式及其解决办法进行了讨论。
The failure models of gold-silicon alloy bonding are discussed and some solving ways are proposed.
并主要针对在半导体器件中应用最为广泛的金-硅合金焊接失效模式及其解决办法进行了讨论。
The failure models of gold-silicon alloy bonding are discussed and some solving ways are proposed.
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