用伪半固态触变成形技术能够成形陶瓷基复合材料，成形温度大大低于高熔点相纳米粉体熔化温度。
The ceramics matrix composites can be formed by pseudo-semi-solid thixoforming and the forming temperature was much lower than the melting temperature of the high-melting phase-nano-powder.
介绍了镁合金半固态触变成形技术中的三个关键技术：非枝晶组织半固态浆料的制备、坯料的二次加热、半固态触变压铸成形。
This paper introduced the key technology of SSP(semi-soild process) thixomolding of magnesium alloys : the preparation of non-dendritic structure, reheating, thixomolding.
本文采用上界理论解法，求解半固态A35 6铝合金触变成形力。
Upper bound theoretical solution is used in this paper to calculate the thixoforming force of semi solid A356 alloy.
本文采用上界理论解法，求解半固态A35 6铝合金触变成形力。
Upper bound theoretical solution is used in this paper to calculate the thixoforming force of semi solid A356 alloy.
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