应用化学镀层法对改性后的CNT镀镍、铜及镍铜混合镀层技术进行了一系列研究。
The plating (layers) such as Ni, Cu and Ni-Cu formed on the CNTs surface by chemical plating process were investigated.
用化学镀法制备了镍包铜粉，并利用固相烧结法将镍包铜粉成功地制成了块状烧结体。
Nickel plat copper powders were prepared by electrolytic plating and bulk sinters of nickel-coated copper powders were prepared by sintering.
在化学镀镍-磷合金液中加入硫酸铜制得镍-铜-磷三元合金。
Electroless nickel copper phosphorus ternary alloy deposits were prepared by addition of cupric sulfate in electroless nickel phosphorus alloy plating bath.
提供了保护过程的技术细节，首先在光纤表面进行化学镀处理获得导电的薄镍层或铜层，然后在该导电层上进行电镀镍。
The fiber is firstly coated with a thin copper or nickel plate with electroless plating method. Then, a thicker nickel plate is coated on the surface of the conductive layer.
采用化学镀技术在预处理后的金属表面上制备镍磷二元和镍铜磷三元镀片，用X射线光电子能谱分析仪和扫描电镜分别对镀片表面的元素价态、组成及镀片表面的形貌进行表征。
The coatings of nickel-phosphor and nickel-copper-phosphor are prepared on the pretreated metal surface by electroless plating technology. The coating surface has been characterized by XPS and SEM.
采用化学镀技术在预处理后的金属表面上制备镍磷二元和镍铜磷三元镀片，用X射线光电子能谱分析仪和扫描电镜分别对镀片表面的元素价态、组成及镀片表面的形貌进行表征。
The coatings of nickel-phosphor and nickel-copper-phosphor are prepared on the pretreated metal surface by electroless plating technology. The coating surface has been characterized by XPS and SEM.
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