提出了化学镀铜今后的研究重点。
The research keystones of copper electroless plating were presented.
探索了丝网化学镀铜和电镀镍工艺。
The technique of chemical deposition of Cu and electroplating of Ni was studied.
化学镀铜层的显微结构受基体的显著影响。
The microstructure of electroless copper deposit is greatly effected by the substrate upon which deposition occurs.
研制了一种新型的钢铁基件酸性化学镀铜工艺技术。
A novel technology of acidic electroless copper plating on steel matrix was studied in this paper.
探讨了化学镀铜工艺条件对银包镍粉电阻率的影响。
The effect of process conditions of electroless copper plating on resistivity of silver coated nickel powder was discussed.
介绍管线钢用高等级埋弧焊丝拉丝工艺、化学镀铜工艺及配方。
To introduce the process of wire drawing process, chemical Cu-plating process and formulation of top grade submerged-arc welding wire for pipe line steel.
研究了氧化锌、氧化亚锡两种固体微粒复合化学镀铜的工艺条件。
In this paper, the conditions of composite chemical copper plating with two solid particles ZnO and SnO are studied.
笔者采用置换反应法在粉煤灰空心磁粉表面进行了化学镀铜的研究。
The replacement deposition method is applied to electroless copper-plating on the magnetic fly-ash powder.
分析气体保护焊丝的锈蚀原因及化学镀铜质量对焊丝防锈能力的影响。
To analyze the rusting cause of gas shield welding wire and effect of chemical Cu-plating quality on its rust prevention capability.
化学镀铜反应受甲醛氧化过程动力学控制，甲醛氧化为铜离子还原提供电子。
Electroless copper depositing processess are controlled by the kinetics of formaldehyde oxidation reaction, which donate electron for the cathodic reduction of cupric ions.
研究表明，玻璃纤维化学镀铜后，可提高导电性能，并用作制备电磁屏蔽材料。
Results showed that the conductive performance of glass fiber with copper plating increased greatly so that the material could use as electromagnetic shield.
探讨了利用原化学镀铜废液中的甲醛将铜还原，后酸化回收EDTA的新工艺。
Copper was reduced by formaldehyde which was contained in the effluent of chemical copper plating, and EDTA in the effluent was reclaimed after acidify.
结果表明：（1 ）陶瓷化学镀铜结合强度较高，化学镀设备简单，成本低廉；
The results of the experiment indicate that: (1) The combining strength is higher in the chemical plating copper on the ceramics;
讨论了常温化学镀铜与着色处理的工艺规范，简单介绍了化学镀铜的影响因素。
Process specifications were discussed. The affecting factors on electroless Cu plating were briefly introduced.
因此，次磷酸钠为还原剂的化学镀铜工艺更适宜应用于对导电性要求相对较低的行业。
Therefore, the deposit using sodium hypophosphite as reductant was more suitable for the industries which had a relatively low requirement on conductance.
通过控制镀液中OH-的补加量，能够准确控制化学镀铜反应进程及表面镀层包覆程度；
The reaction process of electroless copper plating can be controlled by adjusting the OH-additional amounts, thus to control the morphology of Cu coatings.
金属铜与塑料的膨胀系数比较接近，因此，在塑料电镀中常用化学镀铜层作为电镀的导电镀层。
Copper and plastic coefficient of expansion, and, therefore, more close to the plastic used in electroplating electroless copper plating coating layer as conductive.
本发明还提供一种铜 基减摩复合粉末的制造方法，包括：A。制备化学镀铜包覆石墨粉步骤；
The invention also provides a manufacturing method for copper-based antifriction compound powder which comprises: A. the step of preparing chemical copper plating coating graphite powder;
通过对化学镀铜膜形貌和结晶方面的研究发现：籽晶层对铜膜最终形貌和择优取向有较大的影响。
Through the study, we find that the morphology and crystallography of the seed layer has an important effect on the as-deposited Cu films.
在石墨粉表面化学镀铜，以解决金属-石墨复合材料制造中的界面结合力问题并提高其综合性能。
Electroless copper plating was Used for graphite powder to solve the interface problem in metal7 graphite composite material manufacture and improve its comprehensive properties.
对几种散射型防雷达伪装网装饰片基础布的制备工艺进行了比较，选取了织物化学镀铜为其制备工艺。
Several preparation techniques of basic cloths used for scattering anti-radar camouflage net were compared, among which chemical copper-plating was found to be the most suitable one.
研究了影响化学镀铜镀速和镀液稳定性的诸因素，并根据实验确定了适宜的化学镀铜液配方及其工艺。
Factors affecting stability and deposition rate of electroless Cu are investigated and proper formulation and process for electroless Cu bath determined.
该孔金属化工艺是整个刚挠结合板生产制造工艺的核心，包括钻孔、去钻污、化学镀铜、电镀铜等工序。
The hole metallization of rigid-flex PCBs which including Drill, Desmear, electroless plating, Electrical plating, is a key process in the manufacturing of rigid-flex PCBs.
综述了一种对印制线路板通孔镀的方法，即在孔壁上沉积有电镀用的碳黑—石墨层，以取代传统的化学镀铜工艺。
A process for through hole plating is reviewed in which conventional electroless copper plating is replaced by deposition of a carbon black-graphite layer.
本文研究了在化学镀铜的聚酯纤维织物表面采用焦磷酸盐体系电沉积锡镍合金的工艺条件以及合金镀层织物的性能。
A soft electromagnetic shielding fabric was successfully prepared by electroplating tin-nickel alloy on the Cu-plated PET fabric in potassium pyrophosphate system.
ATSADDCOPPERCT系列中沉积速度快，结合力最强的产品，刚挠性基板应用中优先推荐的化学镀铜溶液。
Ct Series ATS ADDCOPPER deposition speed, the strongest combination of product, just flexible substrates recommend priority application of chemical copper plating solution.
结果表明，采用优化后的碳纤维化学镀铜工艺制得的镀铜碳纤维镀覆均匀， 光泽性好， 镀层结合力强，导电性能显著提高。
The results show that the copper plated carbon fiber using optimized electroless copper plating process has even deposit, fine luster, good…
通过对铜原子结构的分析，提出了得到良好结合力的化学镀铜层的可能性，进而给出了使用“考本”液在钢铁上直接化学镀铜的工艺。
Satisfactory colored-films on iron craftworks were obtained by coloring process of electroless Cu plating at room temperature and chemical coloring in turn.
本课题利用化学镀技术在塑料基体上镀铜、镀镍硼，然后将基体塑料溶解得到镍硼箔膜。
In this paper, electroless technology had been used to coating Cu, Ni-B on the surface of plastic matrix first, and then to dissolve matrix plastics in solvent to get Ni-B foil.
本课题利用化学镀技术在塑料基体上镀铜、镀镍硼，然后将基体塑料溶解得到镍硼箔膜。
In this paper, electroless technology had been used to coating Cu, Ni-B on the surface of plastic matrix first, and then to dissolve matrix plastics in solvent to get Ni-B foil.
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