讨论了化学研磨原理及金属哑光表面控制。
The principles of chemical grinding and the control of matt metal surface were discussed.
采用化学研磨法制备了磷酸铁锂，并对其结构和电化学性能进行了研究。
LiFePO4 is synthesized by chemical grinding method, and the structure and electrochemical performances are studied.
医生、牙医和化学家们开发出的牙粉中含有研磨牙齿的物质，如砖灰、碎瓷器、陶器和乌贼。
These powders were developed by doctors, dentists and chemists and included substances very abrasive to teeth, such as brick dust, crushed China, earthenware and cuttlefish.
分析了W -CMP的机理，抛光液对W材料表面具有化学腐蚀和机械研磨的双重作用，对抛光速率有着重要的影响。
The mechanism of W-CMP was analyzed, the slurry makes a dual function of chemical erosion and mechanical lapping, has an important influence on the polishing rate.
用于研磨、装卸、混合、搅拌、粉体输送、干燥炉、溶解炉、医药、化学、水泥、石灰、木器、粉体涂装等作业场所。
For sites with processes such as grinding, loading unloading, mixing, stirring, particle conveyance, dry oven, dissolve tank, pharmaceutical, chemical, cement, lime, wood, powder painting.
研究了重晶石在搅拌磨湿法超细研磨过程中产生的机械力化学效应。
The mechanochemical effect of barite particles is studied during the wet ultrafine grinding by using stirred mill.
此篇报告的重点在于具有化学的、漂白的作用之产品，而不是研磨剂作用之产品。
The review focuses on products which have a chemical, bleaching action rather than an abrasive action.
切勿使用研磨性清洁剂或化学溶剂清洁，以免损坏外壳。
Never use abrasive cleansers or chemical solvents, as they may mar the casing.
制作光纤耦合器的方法有化学腐蚀法、研磨法和熔融拉锥法。
The making methods of optical fiber couplers have chemical corroding, grinding and fused biconical taper method.
半导体制程技术包括氧化、扩散、热处理、合金化、再流动制程、铜制程及化学机械研磨制程简介。
Introduction to semiconductor manufacturing technology including oxidation, diffusion, alloying, re-flow process, copper process and chemical-mechanical polishing.
为制做敷药绷带的基层，专家们把蟹壳研磨成粉末状，又加人一些化学制剂，将基层的聚乙酸氨基葡糖转换成聚氨基葡糖。
To make the dressing, the researchers grind crab shells to a fine powder and mix it with chemicals to convert the base material, chitin, into chitosan.
自动研磨机可以研磨线路板上之树脂，可一机多用；而化学方法则不可以。
The automatic grinding machine is multifunctional, also can be treated against epoxy resin, but chemical process is not possible.
研制了能够实现X、Y、Z三轴直线运动和绕X、Z两轴转动的空间五自由度电化学超精密研磨机床。
An electro-chemical ultra-precision lapping machine with five freedoms of X-, Y- and Z-axis linear movement as well as rotation about X- and Z-axis is developed.
利用一化学机械研磨制程，移除该氧化 物层的部分区域，以使该填满沟槽的氧化物层与该第一多晶硅层大体上齐平。
Through a CMP process, portions of the oxide layer are removed to substantially planarize the trench-filled oxide layer as the first polysilicon layer.
利用一化学机械研磨制程，移除该氧化 物层的部分区域，以使该填满沟槽的氧化物层与该第一多晶硅层大体上齐平。
Through a CMP process, portions of the oxide layer are removed to substantially planarize the trench-filled oxide layer as the first polysilicon layer.
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