-
系统采用包装器外观设计模式及COM软件技术封装仪器驱控制组件。
Instrument control components are enveloped with com software technique and wrapper fa? Ade design pattern.
youdao
-
系统采用包装器外观设计模式及COM软件技术封装仪器驱控制组件。
Instrument control components are enveloped with com software technique and wrapper fa? Ade design pattern.
youdao