针对刻蚀率随入射能量增加而下降的问题，详细研究了刻蚀羽辉在刻蚀过程中的影响；
It is found that etching rate decreases with increasing incident fluences, so the influence of plume in the etching process is studied.
本发明减小了后续刻蚀过程中在半导体器件上产生缺陷的威胁，提高了半导体器件的质量。
The invention reduces the threat of generating defects on a semiconductor device in the subsequent etching process and improves the quality of the semiconductor device.
传统的干法刻蚀不适合用于注入层，因为它的工艺复杂而且在刻蚀过程中可能导致基片损坏。
The feasibility of using traditional dry-etch BARCs is very questionable because they introduce more process complexity and more defectivity and potentially cause unnecessary substrate damage.
在苏加塔湖溢流向图尔卡纳湖的长期过程中，波浪作用在这些曾经的湖岸线上刻蚀出槽口和台阶形痕迹。
During a protracted period when Lake Suguta was overflowing into Lake Turkana, wave action carved notches and terraces into these fossil shorelines.
本文以金属刻蚀去胶腔为背景，简述干刻清洗工艺开发和评价过程。
Based on ash chamber of metal etch this paper describes the full process of dry clean development and evaluation.
根据色分离光栅的实际制作过程建立了包含对位误差、占空比误差、刻蚀深度误差、塌边误差等多种制作误差的色分离光栅加工误差模型。
According to the practical fabrication process of CSG, a comprehensive fabrication error model of CSG including alignment error, duty cycle error, depth error and stair slope error is built up.
介绍了利用软刻蚀紫外模塑技术制作复制聚合物折射和衍射微透镜阵列的工艺过程。
Fabrication process of polymer microlens arrays is introduced based on soft lithographic UV-molding replication method.
电池片表面无划伤，但对于在制作过程中采用激光刻蚀工艺的电池的边沿刻蚀线除外。
No scratch allowed, with exception of laser scratched lines for the cells fabricated with laser for edge isolation.
通过对光刻工艺过程的研究，可为较好地控制正性光刻胶面形，制作微机械、微光学器件提供了参考依据，对微浮雕结构的深刻蚀具有重要的指导意义。
We can better control the positive photoresist figure, provide a reference for making MEMS and MOEMS, it is of an important instructional significance for deep relief of micro structure.
本发明过孔的制备过程工艺简单，操作性比通过刻蚀的方法方便，降低了工艺成本。
The preparation process of the via hole has simple technology, operability is more convenient than an etching method, and the technology cost is reduced.
针对微加工工艺过程造成的残余应力，文中提出了喇曼在线测量方法，并对最常用的三种微加工工艺：淀积、腐蚀或刻蚀及键合进行了喇曼在线测量。
This paper puts forward an online measuring method for measuring the stress in silicon samples prepared with three common micromachining processes: deposition, etching, and bonding.
有些利用复杂的可调双波导结构来实现无跳模波长调谐，但是整个制作过程需要复杂的刻蚀再生长工艺。
However, the laser requires very complex multiple regrowth and etching fabrication process. a novel mode-hop free tuneable diode laser is proposed.
有些利用复杂的可调双波导结构来实现无跳模波长调谐，但是整个制作过程需要复杂的刻蚀再生长工艺。
However, the laser requires very complex multiple regrowth and etching fabrication process. a novel mode-hop free tuneable diode laser is proposed.
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