该孔金属化工艺是整个刚挠结合板生产制造工艺的核心，包括钻孔、去钻污、化学镀铜、电镀铜等工序。
The hole metallization of rigid-flex PCBs which including Drill, Desmear, electroless plating, Electrical plating, is a key process in the manufacturing of rigid-flex PCBs.
介绍了刚挠结合板用自主研发改性粘结片AT - 25与不同柔性材料结合性能研究，与粘结片BH - 25、粘结片AD - 25hh进行比较，结果表明自主研发改性粘结片AT - 25与柔性材料用于刚挠结合板具有较好效果。
This paper we discussed the adhesive property between adhesive AT-25 and different flexible materials in the flex and rigid-flex boards, meantime we make a contrast with adhesive BH-25, AD-25HH.
介绍了刚挠结合板用自主研发改性粘结片AT - 25与不同柔性材料结合性能研究，与粘结片BH - 25、粘结片AD - 25hh进行比较，结果表明自主研发改性粘结片AT - 25与柔性材料用于刚挠结合板具有较好效果。
This paper we discussed the adhesive property between adhesive AT-25 and different flexible materials in the flex and rigid-flex boards, meantime we make a contrast with adhesive BH-25, AD-25HH.
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