砂轮划片机划切技术的研究和应用直接关系到设备应用的好坏。
The research and application on dicing technology of wheel wafer dicer directly decides the relevant equipment application status.
本文介绍了在精度理论指导下进行的砂轮划片机机械系统的设计。
The design of mechanical system of sand-wheel slice cutting machine, under the direction of precision theory, is introduced in this thesis.
在太阳能电池生产中有一道工序叫划片，而划片机是划片工序中必备的关键设备之一。
Slice cutting is a procedure in the production of solar battery while slice cutting machine is one of the necessary equipments in this procedure.
办公室的有限培训针对于7100划片机，7900双轴划片机和977清洗系统，现场培训限于客户的设备类型。
Limited training could be held at the office (for the 7100 dicing system and 7900 our duo spindle dicing systems and 977 washing station) as well as on site training using customer equipment.
从全自动划片机的工作机理出发，分析空气静压电主轴、晶圆传输定位、自动对准、自动清洗等全自动划片机的关键技术；
The key technologies of Auto dicing saw, such as air spindle, transfer and orientation of wafer, automatic alignment and automatic wash are analyzed.
主要阐述了HP- 801精密自动划片机控制程序的设计及实现手段熏为高精密电子专用设备的控制程序设计开发拓展一些思路与方法。
The design method and way for control program of HP-801Automatic Dicing Saw is introduced in the paper. It approaches a path to design control program in semiconductor manufacturing equipment.
主要阐述了HP- 801精密自动划片机控制程序的设计及实现手段熏为高精密电子专用设备的控制程序设计开发拓展一些思路与方法。
The design method and way for control program of HP-801Automatic Dicing Saw is introduced in the paper. It approaches a path to design control program in semiconductor manufacturing equipment.
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