本发明涉及一种废水处理系统及研磨划片废水处理方法。
The invention relates to a wastewater treatment system and a grinding and scribing wastewater treatment method.
该系统主要有学校宏观划片、微观规划和片区拆迁等功能。
The system functions mainly include macro dicing, micro planning and district demolition.
他们在水中为一个划片供能，因此驾驶者可以调整以降低拖力。
They power a blade in the water that the pilot can adjust to reduce drag.
砂轮划片机划切技术的研究和应用直接关系到设备应用的好坏。
The research and application on dicing technology of wheel wafer dicer directly decides the relevant equipment application status.
本文介绍了在精度理论指导下进行的砂轮划片机机械系统的设计。
The design of mechanical system of sand-wheel slice cutting machine, under the direction of precision theory, is introduced in this thesis.
基于已经安装的多光束激光划片系统，其显著的优点已经得到证实。
Upon the installation of a multi beam laser dicing system, the obviously advantages of using such a laser dicing process become evident.
本发明涉及一种半导体装配用胶粘剂膜组合物、胶粘剂膜以 及划片晶粒粘结膜。
The invention relates to an adhesive film composition for assembly of semiconductor, an adhesive film and scribing crystal particle binding film.
在新形势下，传统的税收分类管理方式存在严重不足，划片管理具有更多的优越性。
Under the new situation, the traditional tax classification management method exists serious lack and the management dividing into zones has more superiority.
减薄划片废水经过本发明回用处理，使水资源充分利用回收，节省了大量工业用水。
By the invention, the reduction scribing waste water is reused and processed, thus leading the water resource to be fully utilized and recovered and saving large amount of industrial water.
清单2中的访问计划片段表明IXSCAN操作估计将返回4.85057(约5)行。
The plan segment from the access plan in Listing 2 indicates that the IXSCAN operation will return an estimated number of 4.85057 (approximately 5) rows.
在太阳能电池生产中有一道工序叫划片，而划片机是划片工序中必备的关键设备之一。
Slice cutting is a procedure in the production of solar battery while slice cutting machine is one of the necessary equipments in this procedure.
关键部件均采用进口产品，整机结构简单、划片速度快、精度更高，能24小时长期连续工作。
Imported key spare parts, simple structure for whole machine, fast scribing speed and higher precision, it can work continuously over 24 hours.
办公室的有限培训针对于7100划片机，7900双轴划片机和977清洗系统，现场培训限于客户的设备类型。
Limited training could be held at the office (for the 7100 dicing system and 7900 our duo spindle dicing systems and 977 washing station) as well as on site training using customer equipment.
从全自动划片机的工作机理出发，分析空气静压电主轴、晶圆传输定位、自动对准、自动清洗等全自动划片机的关键技术；
The key technologies of Auto dicing saw, such as air spindle, transfer and orientation of wafer, automatic alignment and automatic wash are analyzed.
主要阐述了HP- 801精密自动划片机控制程序的设计及实现手段熏为高精密电子专用设备的控制程序设计开发拓展一些思路与方法。
The design method and way for control program of HP-801Automatic Dicing Saw is introduced in the paper. It approaches a path to design control program in semiconductor manufacturing equipment.
主要阐述了HP- 801精密自动划片机控制程序的设计及实现手段熏为高精密电子专用设备的控制程序设计开发拓展一些思路与方法。
The design method and way for control program of HP-801Automatic Dicing Saw is introduced in the paper. It approaches a path to design control program in semiconductor manufacturing equipment.
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