在此基础上，建立了以单晶硅为工件材料的分子动力学仿真三维模型，对不同深度下的加工过程进行分析研究。

Then, based on these theories, the three-dimensional model with using monocrystal silicon as the workpiece is built and the processes of different grinding deepness is studied.

youdao

在此基础上，建立了以单晶硅为工件材料的分子动力学仿真三维模型，对不同深度下的加工过程进行分析研究。

Then, based on these theories, the three-dimensional model with using monocrystal silicon as the workpiece is built and the processes of different grinding deepness is studied.

youdao