现有技术中传声器的背侧孔典型地要求在制造过程中于硅片的后表面上进行一种二次机加工操作。

The backside holes of prior art microphones typically require that a secondary machining operation be performed on the rear surface of the silicon wafer during fabrication.

youdao

现有技术中传声器的背侧孔典型地要求在制造过程中于硅片的后表面上进行一种二次机加工操作。

The backside holes of prior art microphones typically require that a secondary machining operation be performed on the rear surface of the silicon wafer during fabrication.

youdao