电镀后用加热法除内应力或电镀时与1%的铅共沉积可避免这一特性。
After plating with heating except with 1% of the internal stress or plating of sedimentary can avoid this lead a characteristics.
并用循环伏安法研究铜砷共沉积过程中铜离子浓度、砷离子浓度等因素对铜沉积过程峰电流密度和峰电势的影响。
Cyclic voltammetry was also used to study the effect of content of cupric ions and arsenic ions on peak current density and peak potential of cyclic voltammetry graphs of copper electrodeposition.
采用稀土改进的化学镀法在多孔陶瓷载体上共沉积钯-银合金膜。
Rare earth improved electroless plating method was developed for simultaneously depositing Pd-Ag alloy film on ceramic support.
在较佳具体实施例中，该共沉积作用系以等离子体强化化学气相沉积法进行。
In a preferred embodiment, the codeposition is carried out by plasma enhanced chemical vapor deposition.
通过循环伏安法、交流阻抗法研究了一种有机络合剂对有机镀液中镁-镍合金在铜上共沉积的影响。
The influence of an organic complexing agent AD on electrodeposition of Mg-Ni alloy in organic bath on Cu electrode was studied by using cyclic voltammetry and AC impedance methods.
通过循环伏安法、交流阻抗法研究了一种有机络合剂对有机镀液中镁-镍合金在铜上共沉积的影响。
The influence of an organic complexing agent AD on electrodeposition of Mg-Ni alloy in organic bath on Cu electrode was studied by using cyclic voltammetry and AC impedance methods.
应用推荐