着重介绍了LIGA工艺中X射线光刻掩模的制作步骤和方法。
The paper introduces emphatically the making step and method of X -ray lithograph etching in LIGA technology.
本发明提供了一种EUV光刻掩模、其制造方法与其使用方法。
An EUV Lithography mask, a fabrication method, and use method thereof is provided.
激光直写系统的应用，可以分成一次曝光制作光刻掩模和多次套刻曝光制作器件两个方面。
Mask making with one step exposure and device making with multiple overlay exposure are applications of the system.
传感器的该导电引线和分路结构可以以公共光刻掩模化和蚀刻工艺形成从而它们彼此自对准。
The electrically conductive leads of the sensor and the shunt structure can be formed in a common photolithographic masking and etching process so that they are self aligned with one another.
本文对大功率可控硅的阻断电压问题、正向压降问题、光刻掩模板的设计问题、控制极特性问题以及动特性问题进行了分析。
This paper analyses the blocking voltage, forward voltage drop, photoresist mask design and gate-triggering and dynamic characteristics of high-power thyristors.
氧化物、掩模或标线的不透明区域，或光刻层中不需要的小孔。
A small undesired hole in an oxide opaque region of a mask or reticle or in a photoresist layer.
对于要求同时检测矩形或接近矩形槽形的全息光刻胶光栅掩模的槽深和占宽比，该方法完全适用。
The method is qualified for measurement of groove depth and duty cycle simultaneously for the rectangle-shaped or similar profile of holographic grating mask.
提出了优化实验参数、增加束掩模和利用刻蚀技术三种改善原子光刻实验的方法。
Three solutions of optimization of experimental parameters, adding beam mask and using etching technologies for improving atom lithography quality are presented.
掩模制作是电子束散射角限制投影光刻(SCALPEL)的关键技术。
Mask fabrication is a key technique of scattering with angular limitation projection electron-beam lithography (SCALPEL).
我们研制的非硅表面微机械工艺采用两次或三次掩模电镀层，聚酰亚胺和光刻胶分别作为底层和第二、第三层的牺牲层。
We developed a non silicon surface micro machining process with two or three mask electroplating layers and using polyimide or photoresist as sacrificial layers.
在同步辐射X射线光刻中，由于掩模的初始张应力和掩膜的非均匀受热将使掩模产生热畸变。
In synchrotron radiation X-Ray lithography, distortion of mask is caused by its initial tension, stress and inhomogeneous thermal effect.
SU 8光刻胶已应用于LIGA技术的标准化掩模制造工艺和一些器件的研究工作。
Now SU8 resist has been used to make the LIGA mask for the LIGA standard process and some devices researching work.
给出了该掩模设计制作工艺过程及深x射线光刻结果。
The fabrication procedure of the mask and results of the deep X ray lithography are given.
详细地论述了相移掩模提高光刻分辨力和改善焦深的原理。
The principle for improving microlithographic resolution and focal depth with phaseshifting mask is described in detail in the paper.
光刻是大规模集成电路生产流程中十分关键的一环，而光刻中使用的掩模的质量对大规模集成电路的成品率有很大的影响。
In the manufacture process of integrated circuit (IC), lithography occupy a very important step, and the quality of photomask used in lithography affects the yield of LSI.
阐述了X射线镂空硅掩模的研制及其在同步辐射深层光刻中的应用。
The fabrication of X-ray stencil silicon mask and its application in X-ray deep lithography are presented in this paper.
通过灰度掩模平面不同位置处提供可变的透过率，经一次光刻后得到所需的衍射光学元件。
A variable transmittance is provided to different position on grayscale mask plane and the required diffractive optical elements can be obtained after one-time exposure.
接近式光刻中一般采用柯勒照明系统，并采用蝇眼透镜形成多点光源均匀掩模面的光场分布。
Kohler illumination was used in proximity lithography, and a flys eye lens was adopted to form multi-point source in order to uniform the light intensity on the mask plane.
它应用了光学相移掩模方法，大大提高了现有光学光刻设备的分辨率水平。
It utilizes optical phase shifting mask to improve resolution limit for an existing wafer stepper.
原子全息光刻即采用二元计算全息片掩模来操纵原子，实现微细结构的制作。
Atom hologram lithography employs binary computer generated hologram to handle atoms for making microstructure.
同时限制在掩模图案的光刻增加步骤以三个或更少，甚至没有施加的MTP规格为写入时间提高了新工艺的性能。
Applying MTP specifications for write times improves the new process's performance while limiting increased steps in mask pattern lithography to three or fewer, and even none.
LDD和SOI结构； 移相掩模光刻技术和多层金属布线工艺。
The short channel effects , the structure of LDD and SOI, phaseshift mask and multilevel interconnection were included.
对深入理解和认识接近式深度光刻机的掩模-硅片间衍射的物理本质提供了更为方便的研究手段。
It provides more convenient research means for understand the physical essence of diffraction between mask and wafer of proximity deep stepper.
激光光刻是加工微光学及二元光学掩模的主要手段。
Laser lithography is one of the main methods for manufacturing micro-optical and the binary optical masks.
激光光刻是加工微光学及二元光学掩模的主要手段。
Laser lithography is one of the main methods for manufacturing micro-optical and the binary optical masks.
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