• 晶片光二极体封装件,散热该发光二极体晶片直接接触或经由一散热间接接触。

    The light source is a light-emitting diode or an encapsulated light-emitting diode, and the heat sinking fluid can contact the light-emitting device directly or indirectly via a heat sinking plate.

    youdao

  • 晶片光二极体封装件,散热该发光二极体晶片直接接触或经由一散热间接接触。

    The light source is a light-emitting diode or an encapsulated light-emitting diode, and the heat sinking fluid can contact the light-emitting device directly or indirectly via a heat sinking plate.

    youdao

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