本论文研究了MCM中芯片安装互连、芯片倒装焊接及其关键支撑技术等内容。
This paper talks about the major supporting technologies for MCM package: the Interlinkage of Chips, Flip Chip Bonding, Flip Bonding.
IC芯片以倒装焊接或金属线焊接或粘贴连接安装于金属基片的有介质涂层的表面。
An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon.
IC芯片以倒装焊接或金属线焊接或粘贴连接安装于金属基片的有介质涂层的表面。
An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon.
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