集成电路倒装芯片封装中半导体铸模和载波器的焊料中的铅；
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
基 板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性。
Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.
倒装芯片的应用对出光效率的提高特别是散热处理达到了较好的效果。
Flipchip's applying is good for improvement of efficiency of light emitting of LED and especially for thermal management.
板上倒装芯片(FCOB)作为一种微电子封装结构形式得到了广泛的应用。
Flip Chip on Board (FCOB) has been used widely as a microelectronics packaging structural form.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages.
提出了无铅印料的配方及性能要求，说明了无铅印料在倒装芯片与表面贴装中的应用。
The essay separately introduced request, realizing approaches and comparison on the pros and cons in accordance with the MES application in SMT.
论述了如csp、BGA及倒装芯片等先进封装技术在微电子工业中所发挥的重要作用。
And the important role of advanced packagings such as CSP, BGA and Flip-chip technology in the microelectronics is described as well.
将实现3d互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。
The methods of 3d interconnection can be classified into the wire bonding, flip chip, through silicon via (TSV) and film wire technology, whose advantages and disadvantages are analyzed.
在圆片规模上开始加工，结束于芯片规模的圆片级封装技术将在面型阵列倒装芯片的封装中得到日益广泛的应用。
The WLP technology that initiates processing from Wafer-Level and finishes in chip scale will be applicable on a daily broadening scale in plane array FCP.
由于在印制电路板上的倒装芯片和CSP器件的紧凑设计，声音微图像己经成为检测这些封装的非常重要的一部分。
Because of the compact design of flip chips and CSP on PCB, acoustic micro imaging has become extremely important for inspecting these packages.
IC芯片以倒装焊接或金属线焊接或粘贴连接安装于金属基片的有介质涂层的表面。
An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon.
通过对芯片进行背面减薄和倒装连接，可以实现有源芯片的埋嵌。
The embedded active chip also can be realized by backside thinning and flip chip bonding.
介绍了芯片倒装焊的重要意义、发展趋势、基本的焊球类型、制作方法及焊球质量的检测技术。
This paper introduces the forward trends of flip chip bonding, the essential kinds of bumps, fabrication technology and testing technology about qualities.
采用多普勒激光振动测量系统，获得了热超声倒装键合过程中工具末端及芯片的振动速度曲线。
With the Doppler laser vibration measurement system, the vibration velocity curves of the flip chip and tool tip were obtained during thermo-sonic flip chip bonding.
基于最小能量原理建立了多芯片组件(MCM)倒装焊焊点成形预测模型，对其三维焊点形态进行了有效预测。
Based on minimal energy principle, Evolving model of flip-chip 3-d shape prediction of MCM is established, and 3-d solder shape is effectively predicted.
对刚性基板倒装式和晶圆再分布式两种结构的芯片级封装（CSP）进行了研究，描述了CSP的工艺流程；
Chip scale package (CSP) for flip-chip on hard substrates and wafer re-distribution is studied, and its process flow is described.
本发明涉及一种倒装led芯片的封装方法，属于LED制造领域。
The invention relates to a packaging method for flip LED chips, which belongs to the field of LED fabrication.
本论文研究了MCM中芯片安装互连、芯片倒装焊接及其关键支撑技术等内容。
This paper talks about the major supporting technologies for MCM package: the Interlinkage of Chips, Flip Chip Bonding, Flip Bonding.
对各种正装和倒装焊功率型LED芯片的表面温度分布进行了直接测试，对其散热性能进行了分析。
The temperature distribution of power LEDs is measured, and the performance of thermal dispersion is discussed.
对各种正装和倒装焊功率型LED芯片的表面温度分布进行了直接测试，对其散热性能进行了分析。
The temperature distribution of power LEDs is measured, and the performance of thermal dispersion is discussed.
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