采用这种技术时,电路板的元件侧专用于接地层,信号走线则布设在焊接侧。
In this technique, the component side of the board is dedicated to the ground plane, and signal traces are placed on the solder side.
电路板至少需要4层才能实现最佳布局和性能:一个接地层、一个电源层和两个信号层。
Best layout and performance are achieved with at least a 4-layer multilayer board, where there is a ground plane layer, a power supply layer, and two signal layers.
电路板至少需要4层才能实现最佳布局和性能:一个接地层、一个电源层和两个信号层。
Best layout and performance are achieved with at least a 4-layer multilayer board, where there is a ground plane layer, a power supply layer, and two signal layers.
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