随着深亚微米技术,串扰噪声问题越来越严重。
With deep submicron technology, crosstalk noise becomes more and more serious.
分析了深亚微米技术对IDDQ测试的影响以及IDDQ的改进方法。
Then, the influence of deep-submicron technology on IDDQ testing is explained. And the improved IDDQ testing methods are also given.
该方法采用边界拟合和“路径匹配”技术,使位移量的检测精度达到了亚微米级。
Sub-micron accuracy of displacement detection is obtained by adopting edge fitting technology and path matching technology.
光致旋转技术已经在很多领域被用来作为操纵单个微米、亚微米级微粒,具有广阔的发展前景。
Optical rotation technology has been used in many fields as manipulating a single micron, submicron particles, and has broad prospects for development.
表面要求具有纳米粗糙度和亚微米精度的高质量易损晶体的生产是一种生产重要光学仪器的技术。
The production of high quality surfaces with nanometric roughness and sub-micrometer accuracy on brittle crystals is an emerging technology having important optical applications.
就目前而言,已有的离子注入技术(包括离子注入设备系统)尚不能满足甚亚微米器件和电路制造的需要。
Now, the present ion implantation technology, especially ion implantation equipment and systems, can not meet the needs in the manufacturing of deep submicron devices and circuits.
深亚微米和纳米级的半导体技术迅速进步,使得集成电路的设计已经进入系统集成芯片时代。
The rapid progress of semi-conductor technology on deep sub-micro and nanometer scale announces the SOC era of IC design.
光刻校正技术已成为超深亚微米下集成电路设计和制造中关键的技术。
The optical lithography correction techniques become key technologies in the IC designing and manufacturing of VDSM.
本文综述了深亚微米光刻和纳米光刻技术。
In this article, deep submicron lithography and nano processing are reviewed.
综述了亚微米、深亚微米干法刻蚀和相关技术的最新进展及其在超大规模集成电路制造中的应用。
The latest advance of the dry etching for submicron fabrication in ULSI production and interrelated technology are introduced.
本文主要论述亚微米cmos门阵列的设计技术,包括建库技术,可测性设计技术、时钟设计技术、电源、地设计技术、电路结构优化、余量设计技术等,最后给出了应用实例。
In this paper, design technologies of sub-micron CMOS gate array, such as building library, testability, clock design, power-ground design, architecture optimizing, margin design, are presented.
本项研究针对影响超深亚微米物理设计的主要技术难点信号完整性问题,在提高电源规划质量的同时,分别对串扰效应和天线效应进行了相应的抑制。
As for the SI which is the main problem for VDSM physical design, the design offers a correspondent restraint to crosstalk and antenna while improving power plan.
笔者分析并综述了现代颗粒测试的方法和技术 ,讨论了这些方法应用于亚微米级超细颗粒的测量时存在的问题和局限。
Modern methods for particle sizing are stated and analyzed. Some problems are discussed when these methods are used for submicron particles.
目前,利用半导体器件制造过程中的蚀刻技术,在实验室中已制造出亚微米级的机械元件。
At present, the semiconductor devices used in the manufacturing process of etching technology, in the lab has produced sub-micron mechanical components.
深亚微米光学光刻工艺技术目前面临着越来越严重的挑战。
Deep? Sub? Micron optical lithography process is facing more and more serious challenge.
本文从最基本的角度出发,介绍了亚微米分步重复投影光刻机中的一项新的检测技术——基准校正技术。
A new detecting technique-correction technique for datum in submicron DSW is introduced from the basic point of view.
光 散射技术是测量纳米及亚微米颗粒粒径的有效方法。
The dynamic light scattering is an effective method to measure grain diameter in nanon and submicron.
与现有技术相比,本发明能够使高聚物加工成亚微米级的粒子, 且粒子粒径分布均一,呈规整球形。
Compared with the prior art, the method can process the high polymer into submicron particles, and the particles which have uniformly distributed granular diameters are regularly spherical.
与现有技术相比,本发明能够使高聚物加工成亚微米级的粒子, 且粒子粒径分布均一,呈规整球形。
Compared with the prior art, the method can process the high polymer into submicron particles, and the particles which have uniformly distributed granular diameters are regularly spherical.
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