该钝化层(18)被图案化以形成第一开口(20)以接触最后的互连层(16)。
The passivation layer (18) is patterned to form a first opening (20) to contact the last interconnect layer (16).
随后沉积阻挡层(22)使其接触最后的互连层(16)并由聚酰亚胺层(22)定界。
The barrier layer (22) is then deposited in contact with the last interconnect (16) layer and bounded by the polyimide layer (22).
钝化层(18)和聚酰亚胺层(22)将最后的互连层(16)和接合焊盘(28)隔开。
Both a passivation layer (18) and a polyimide layer (22) separate the last interconnect layer (16) and the bond pad (28).
一种半导体器件(10)，具有在最后的互连层(16)和接合焊盘之间的接触，该接合焊盘包括接合焊盘(28)和最后的互连层(16)之间的阻挡金属(26)。
A semiconductor device (10) has contact between the last interconnect layer (16) and the bond pad that includes a barrier metal (26) between the bond pad (28) and the last interconnect layer (16).
然而，如果火成岩和变质岩中发生大规模的断裂，并且断裂系统相互连通，那么它们也可以作为地下水储集层。
However, even igneous and metamorphic rocks may act as groundwater reservoirs if extensive fracturing occurs in such rocks and if the fracture system is interconnected.
请注意，ESB被描绘成一个集成层，用于支持解决方案的业务组成部分之间的互连。
Note the portrayal of the ESB as an integration layer underpinning the interconnectivity among the business parts of the solution.
模块互连体系结构视图描述功能分解和如何在不同的层中安排软件模块？
Module interconnection architecture view Describes the functional decomposition and how the software modules are arranged in different architectural layers.
此外，垂直语言单元按级别组织成三层，通过在那些可用的层上增加建模能力可以形成相互连续的更高层。
Furthermore, the vertical language units are hierarchically organized into up to three levels, with each successive level adding more modeling capabilities to those available in the levels below.
US b物理互连是分层的星形拓朴，最多有七层。
The USB physical interconnect is a tiered star topology, with up to seven tiers.
Semantic技术在现有的IT技术之上提供了一层抽象，它跨越业务和IT仓库在数据、内容和过程之间架设了一座桥梁，使其可以相互连接在一起。
Semantic technologies provide an abstraction layer above existing IT technologies, one that enables the bridging and interconnection of data, content, and processes across business and IT silos.
在开放系统互连osi模型中，路由是网络层(第三层)的功能。
Routing is a function associated with the network layer (layer 3) in the standard model of network programming, the Open Systems Interconnection (OSI) model.
本文从网络互连的角度出发，讨论用于OSI网关的无连接网络层协议CLNP的功能选取与实现。
In this paper, we describe a selection and implementation of the functions of CLNP for OSI interconnection to implement a gateway.
金属化是淀积一层薄薄的金属膜的工艺，将其制成模版用于形成所需的内部互连排列。
Metallization is the process of depositing a thin film of metal and patterning it to form the desired interconnection arrangement.
之前花园和车间入口处没有相互连接，因为有窗户存在，因此这层关系就被遗忘。
There was no connection between the garden of entrance and the workshop because in spite of having Windows this relation was lost.
同一层次的各个模块互连构成这一层次的硬件结构，仿真可以在设计的各个层次进行。
The interconnecting of the modules on the same design level comprises the hardware structure of this level and the simulation can be made on every level of the design.
该半导体晶片上形成的一层互连膜与绝缘膜的可靠性可以在加速条件下加以评估。
The reliability of an interconnection film and insulating film formed on the semiconductor wafer are evaluated under an accelerated condition.
印制板和其它互连结构用材料。包被和非包被增强基材。酚醛纤维素纸增强铜包被经济级叠层板。
Materials for printed boards and other interconnecting structures - reinforced base materials, clad and unclad - phenolic cellulose paper reinforced laminated sheets, economic grade, copper - clad.
在开放系统互连模型中两个相邻层间的边界。
对有钝化层与无钝化层的铝互连线的热应力进行了数值模拟，并建立起互连线的二维有限元模型。
Two-dimensional finite element modeling was used to simulate the thermal stress in unpassivated and passivated aluminum thin film interconnects.
研究表明互连线上焦耳热的主要散热途径为金属层内的金属线和介质层中热阻相对小的路径。
The Joule heat generated in the interconnect is transferred mainly through the metal lines in each metal layer and through the path with the smallest thermal resistance in each Ield layer.
研究了多层金属互连网络的热学模型，详细计算了不同的介质材料、金属线间距、金属层间距和电流密度对多层金属互连线温度分布的影响。
Different dielectric material, metal wire separation, metal level separation and current density for impact of multilevel metal interconnects are calculated in detail.
像ISDN和dsl,HSSI运营网络的物理层，使用标准的开放系统互连(osi)模型。
Like ISDN and DSL, HSSI operates at the physical layer of a network, using the standard Open Systems Interconnection (OSI) model.
在例如一个实施例中，地面101包括多层电路板的若干相互连接的层。
In one embodiment for example, the ground surface 101 includes several inter-connected layers of the multi-layer circuit board.
形成穿过掩埋绝缘层的互连结构，以连接集成电感器和集成电路。
An interconnection structure is formed through the buried insulating layer to connect the integrated inductor to the integrated circuit.
在开放系统互连(osi)参考模型的通信，媒体访问管理执行的媒体访问控制(mac)子层的链路层的。
In the Open Systems Interconnection (OSI) communication reference model, media access management is performed by the media access Control (MAC) sublayer of the Data-Link layer.
本发明技术方案能够使印刷线路板中任意层信号互连。
The technical scheme can lead signals at all layers in the printed circuit board to be connected with each other.
刚性蚀刻停止层的存在，有助于减少互连线的热应力和塑性应变。
The existence of rigid etch stop layer helped to reduce the thermal stress and plastic strain.
这座别墅一个重要的主题是，设计一座三层之间相互连接贯通的空间。
An important theme while designing the house is de spatial connection between the three floors.
这座别墅一个重要的主题是，设计一座三层之间相互连接贯通的空间。
An important theme while designing the house is de spatial connection between the three floors.
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