服务密度越来越大，并且各种服务之间的互连程度也越来越高。
Service density is increasing, and the level of interconnection between services is also growing.
随着IC的高速化、高集成化、高密度化和高性能化，芯片内互连线之间的串扰已经成为影响芯片性能的重要因素之一。
With the IC's higher speed, higher integration, higher density and higher performance, crosstalk has become one of the most important factors which can influence the IC's performance.
低温共烧陶瓷(LTCC)技术是实现微波电路与系统小型化、高密度的重要组装和互连技术。
Low temperature co-fired ceramics (LTCC) becomes an important packaging and interconnecting technology for realizing microwave circuit and system's miniaturization and higher density.
作为VLS I互连线的金属薄膜的截面积越来越小，其承受的功率密度急剧增加，使得电迁移成为电路的主要失效模式之一。
Consequently, the metal interconnects of VLSI have smaller sectional area and carry increasing power density, which made the electromigration become one of the main latent damage modes.
针对先进纳米铜互连技术的要求，研究了脉冲电流密度对铜互连线电阻率、晶粒尺寸和表面粗糙度等性能的影响。
Aiming at the technology demand of advanced copper interconnection, the effect of pulse current density on cu layer properties such as resistance, crystal size and surface roughness were investigated.
供应商是否有能力提供高密度互连和微盲孔板的制造能力？
Does supplier have the ability to develop HDI or Microvia process?
研究了多层金属互连网络的热学模型，详细计算了不同的介质材料、金属线间距、金属层间距和电流密度对多层金属互连线温度分布的影响。
Different dielectric material, metal wire separation, metal level separation and current density for impact of multilevel metal interconnects are calculated in detail.
高密度互连。
高密度互连。
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