对于垂直通孔互连问题，时域有限差分法更具优势。
FDTD method is better than the other one for vertical via interconnect problem.
采用虫孔切换技术容易造成互连网络寻径的死锁。
The interconnection networks which USES the wormhole switching technology can easily make deadlock.
本研究重点研究了MCM—C基板的可靠性，包括厚膜电阻，基板布线以及互连通孔。
This paper mainly studies the reliability of substrates of MCM-C including thick-film resistors, metal lines and vias for interconnection.
粘固剂中的互连大孔可以实现血管形成、生长因子夹带、细胞移生和组织向内生长。
The interconnected macroporosity in the cement allows for vascularization, entrapment of growth factors, cell colonization and tissue ingrowth.
供应商是否有能力提供高密度互连和微盲孔板的制造能力？
Does supplier have the ability to develop HDI or Microvia process?
将实现3d互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。
The methods of 3d interconnection can be classified into the wire bonding, flip chip, through silicon via (TSV) and film wire technology, whose advantages and disadvantages are analyzed.
垂直通孔互连是微波多芯片组件封装工艺和理论分析的基础，开展垂直通孔互连的研究有着现实的意义。
Because vertical via interconnect is the base of theoretical analysis and package technics of MMCM, further study on vertical via interconnect is very vital and instructive to reality.
本文详细地讨论了考虑通孔自热的金属互连系统温度分布解析模型以及热点在通孔内形成的临界条件。
This paper presents an analytical thermal model considering via self-heating for estimating the temperature of metal wires and vias and the critical condition for hot spot formation within the vias.
结果表明：蜂窝结构硅橡胶泡沫材料内部为大小不等但相互连通的开孔网络结构，泡沫与硅橡胶之间无明显界面；
The results showed that the honeycomb laminates had an interlinking open cell structure without remarkable interface between silicone rubber and silicone rubber foam;
结果表明：蜂窝结构硅橡胶泡沫材料内部为大小不等但相互连通的开孔网络结构，泡沫与硅橡胶之间无明显界面；
The results showed that the honeycomb laminates had an interlinking open cell structure without remarkable interface between silicone rubber and silicone rubber foam;
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