旋转连接器是一种自由空间动态光互连器件。
Optical rotary joint is a free space interconnection component.
本文利用微光学技术设计并研制了一种同时具有滤波、分束和成象功能的二元光学全互连器件。
A novel binary optical element, which has the functions of filtering, beam-splitting and imaging, is designed and fabricated.
在这种背景下，众多研究机构均投入了大量的人力物力进行相关技术的开发，并希望制定属于自己的光互连器件和标准。
Many research institutions have invested a lot of manpower and resources to develop the related technologies and wish to develop their own optical interconnect devices and standards.
问题可能出在器件的互连或工作在正常的时钟频率时集成电路就不能正常的运行了。
The problem might be an interaction between components or an IC that fails when run at normal operating clock rates.
随着VL SI器件特征尺寸的缩小，对互连集成技术提出了新的要求。
New requirements are presented to interconnection integration technology because of the decreasing feature dimension in VLSI devices.
在多层互连基板中，基板材料的介电常数直接影响器件信号的传输速度。
In multilayer interconnected substrate dielectric constant of the substrate materials immediately affects transfer velocity of signal in the device.
金属还原方法，多层互连结构及制法，半导体器件及制法。
Method for reducing metal, multilayer interconnection structure and manufacturing method for the same, and semiconductor device and manufacturing method for the same.
光互连与光交换系统的实现有赖于光开关，光探测器，激光器等光电子器件的进展。
The implement of optical interconnection and optical switching lies on the development of optical switch, photodetector (PD), laser etc.
论文分析了当前的研究状况，介绍了集成电路工艺变异的内容及对集成电路器件、互连以及电路性能的影响。
This thesis analyzed the current researching situation, introduced process variations and the influence to IC devices, interconnect and circuits.
一种半导体器件(10)，具有在最后的互连层(16)和接合焊盘之间的接触，该接合焊盘包括接合焊盘(28)和最后的互连层(16)之间的阻挡金属(26)。
A semiconductor device (10) has contact between the last interconnect layer (16) and the bond pad that includes a barrier metal (26) between the bond pad (28) and the last interconnect layer (16).
HPC器件的独特结构减少了由于PC B上的互连线路缩短而引起的寄生现象，并通过缩短组件间的距离提高了电路性能。
HPC devices 'unique construction reduces parasitics by shortening interconnecting traces on PCBs and improves circuit performance by decreasing the distance between components.
几乎每种电子设备，小到电子手表、计算机，大到计算机、通信设备、军用武器系统，只要存在电子元器件，它们之间的电气互连就要使用印制电路板。
It is one of the important components of electronic products. For almost every electronic equipment, electrical interconnection between them must use printed circuit boards.
COF是一种高性能、多芯片封装工艺技术，在此封装中把芯片包入模塑塑料基板中，通过在元器件上形成的薄膜结构构成互连。
COF is a high performance, multichip packaging technology in which dies are encased in a molded plastic substrate and interconnects are made via a thin-film structure formed over the components.
随着没有止境的摩尔定律的继续以及网络通信的持续增长，对器件带宽的需求使得基于铜线的传统互连技术已越来越接近极限。
As the Moore's law continues, and Internet-based communication continues to grow, the bandwidth demands will continue to increase and push the limits of copper-based technologies.
随着没有止境的摩尔定律的继续以及网络通信的持续增长，对器件带宽的需求使得基于铜线的传统互连技术已越来越接近极限。
As the Moore's law continues, and Internet-based communication continues to grow, the bandwidth demands will continue to increase and push the limits of copper-based technologies.
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