为提高陶瓷金属化层的焊接性能，提出了一种陶瓷二次金属化镀镍工艺。
In view of the poor solderability of metallic film formed on ceramic surface, a secondary metallization of ceramic surface by nickel plating was advanced.
为提高陶瓷金属化层的焊接性能，提出了一种陶瓷二次金属化镀镍工艺。
In view of the poor solderability of metallic film formed on ceramic surface, a secondary metallization of ceramic surface by nickel plating was advanced.
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