内透镜与所述发光二极管芯片一起封装，封装后的二极管模块包括底座；
The inner lens and chip of LED are sealed together. The sealed LED module includes base;
提供了一种新的二极管芯片识别检测的任务规划方法，并提供了相应的数据结构，以及参数的计算方式。
A new task planning of diode chips detection, the corresponding data-structure and the calculation method of correlative parameter are put forward.
其作用是改变发光二极管芯片的光的发射方向，将大部分光从侧面，沿垂直于发光二极管芯片中心轴线的方向聚集在很小的角度内向周围发射。
Being gotten together in very small Angle along direction perpendicular to central axis of chip of LED, most of light transmits around from side face.
其作用是改变发光二极管芯片的光的发射方向，将大部分光从侧面，沿垂直于发光二极管芯片中心轴线的方向聚集在很小的角度内向周围发射。
Being gotten together in very small Angle along direction perpendicular to central axis of chip of LED, most of light transmits around from side face.
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